NDS200 - Programmable dicing saw for wafer & substrate up to 6/8"

+ d'infos..

Recently released, the NDS200 is a new dicing saw with advanced features specifically adapted for Semiconductor materials cutting (Si, GaAs, LiNBO3, LitAO3, and hard and brittle materials such as glass, ceramics, quartz... » 0.1mm/s to 400mm/s of feedrate allows prototying and production dicing » The saw accepts hubless or hubtype blades with metal or resin bond up to 3" diameter » Pc control programming for easy set up » Joystick control for manual control of specific cutting (irregular pitch or depth...) » Accepts all sample sizes up to 8" » CE mark for use in Europe