Plastic Grip-Ring for wafers up to 12"

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Used to firmly maintain the adhesive film during dicing processes or typically after a film expansion » These plastic griprings are made in strong polycarbonate » A typical use is expanding from metal wafer-frame to plastic ring with an equipment of the UH130 family largely separating the dies for a safe picking » The black rings are conductive and antistatic » Available for 12" wafers

Models

AP4 : Plastic gripring for 4" wafer

AP4B : Antistatic gripring for 4" wafer

AP5 : Plastic Gripring for 5" wafer

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Wafer film frame used for dicing wafer-substrate

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Wafer film frames for 6" (and smaller), 8", 12" wafers » Stainless steel material » Supplied in several sizes depending upon dicing equipment used & Wafer size » Consult MW for more details & Pricing... » Plastic frames available too, see the different models

Models

FF020 : Wafer film frame for 4" wafers

FF070 : Wafer film frame for 6" wafers

FF070P : Plastic wafer film frame for 6" wafers

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