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1 - ELECTRICAL CHARACTERIZATION OF SEMICONDUCTIVE LAYERS
NEW
: SOLAR CELLS CHARACTERIZATION
A - CHARACTERIZATION BY C-V / I-V
Measurements of C-V / I-V by NEEDLE PROBING
MERCURY PROBE C-V characterization Equipment
Options & Accessories / C-V characterization
B - RESISTIVITY MEASUREMENT BY 4-POINT PROBE METHOD
Sheet resistivity 4 POINT-PROBE-SYSTEMS semiconductors range
Spécial for USJ junctions leakage measurements
Configuration :
Hand-held
resistivity measurement
Configuration :
High resistivity
measurement
Configuration : Very
low resistivity
measurement
MERCURY CONTACT Four-Point Probe
4-POINT-PROBE-HEAD for resistivity measurement
Micropositioner specific for 4 point probe head
Options & Accessories / Resistivity measurements
C - CHARACTERIZATION BY HALL EFFECT
Hall effect & Other parameters measurement Equipment
Options & Accessories / Hall effect characterization
2 - WAFER BACKGRINDING & BACKTHINNING
A - BACKTHINNING OF INDIVIDUAL DIES (Service)
B - ADHESIVE TAPE FOR BACKGRINDING
C - UV CURING SYSTEMS
D - WAFER BACKLAPPING FILM APPLICATION & REMOVAL
Wafer backlapping film laminators & Removal
Options & Accessories for wafer backgrinding lamination & Removal
3 - VISUAL INSPECTION & OPTICS
A - Microscopes & Binocular
B - Objectives and eyepieces
C - Accessories
Cameras
4 - PROBING OF MICROSTRUCTURES
A - PROBERS FOR ELECTRICAL ANALYSIS AND CHARACTERIZATION
General purpose probers
(design, failure analysis, small production...)
RF & MICROWAVE
(and specific MEMs...) probers
B - ACCESSORIES FOR PROBING APPLICATIONS
Microscopes
Anti-vibration tables
Precision micropositioners
Microtools (MEMs testing, biological...)
Probe holders
Probe needles
Specific probes (active-Coaxial-Kelvin...)
Thermal chucks - Temperature testing
Lasers for removing metal and layers
Miscellaneous other accessories
Vacuum pump & compressor
Specific
accessories for RF & Microwave
applications
Specific RF positioner
RF-Microwave probes
RF & microwave cables
C - HIGH DENSITY CANTILEVER & VERTICAL PROBECARDS
D - CLEANING SHEETS FOR PROBECARDS ONLINE CLEANING
5 - DICING OF SILICON AND OTHER SUBSTRATES
A -
DICING MACHINE
B - ADHESIVE TAPES FOR WAFERS & SUBSTRATES
Standard adhesive tapes
UV adhesive film
C - WAFER/FRAME FILM LAMINATION
Wafer/Frame film mounters
Options & Accessories
D - DIAMOND DICING WHEELS FOR ALL THIN MATERIALS
Hubless type used with mounting flanges
Hubtype blade ready to use
E - ULTRAVIOLET FILM IRRADIATORS
UV curing equipment
Manual UV lamps
Options & Acessories
F - FILM EXPANSION AFTER DICING
G - CLEANING & BRUSHING AFTER DICING
H - ACCESSORIES RELATED TO DICING
Plastic rings & Metal frames
Mounting flanges for Hubless blades
Other accessories related to dicing
6 - TESTS OF FINISHED COMPONENTS & BURN IN
A1 - SOCKETS
NEWS
A2 - STANDARD SOCKETS FOR BURN IN AND TESTS
BGA/CSP, LGA Packages
QFN packages
Specific sockets for high dissipation devices
Sockets Axial-Radial & MELF packages
Sockets for TO, SIP, DIP packages
LCC, FlatPack, SMD, Microwave & Hybrids
ZigZag sockets & Staggered
Sockets for PLCC/SOJ & "Gull Wing" packages
Optical transceiver sockets & PGA
Connectors
B - BURN IN BOARDS - HUMIDITY & HAST BOARDS
C - SPRING TEST PROBES (POGO PINS)
D - TESTS INTERFACE BOARDS
E - INSTRUMENTS & SOFTWARES
7 - COMPONENT HANDLING & PACKAGING MATERIALS
Microhandling & Micro-tools
8 - SUBCONTRACT SERVICES PROTOTYPES
Category :
Options & Accessories
4
Product(s) found(s)
Blade type Circular cutter
+ d'infos..
The replaceable circular cutting knife blade is
now replaced by the
"Wheel-type" cutter
which allows a much longer lifetime
» The Wheel-type is field retrofittable
» Please consult MW with your machine serial number to obtain a quote
Models
2420001000
: Circular cutting knife blade
Wheel type Circular cutter
+ d'infos..
The alternative to the standard circular cutting knives (blade type)
where the frequent replacement when worn out can be a problem in production
» The Wheel type cutter is using
a non-wearing roller wheel with adjustable depth upon the film thickness
» The lifetime is very high & No maintenance is required
» This new wheel cutting type is mounted on new equipment and is now retrofitted to the olders, please consult MW for details.
Standard vacuum chuck
+ d'infos..
These vacuum chucks are used for 2 to 12" wafers
» The vacuum is distributed from the center through a small cross and they are particularly recommended for "normal" thicknesses wafers
» For thin wafers or bumped wafers not allowing contact on the active side,
specific thin wafers chucks
or
non-contact "SofTouch
"
may be more adapted.
Models
CVS4602001
: Standard vacuum multi-chuck 3-6"
CVS4602004
: Standard vacuum 4"
CVS4602006
: Standard vacuum 6"
Search limited to 3 Models / Product
All models here ..
Non-contact "SofTouch" vacuum chuck
+ d'infos..
Vacuum chuck with
peripheral contact only
(<3mm) on the wafer
, allows mounting and holding wafers with bumps or particularly fragile with
no contact on the active side
» A
new silicone rubber seal
insures that the vacuum will hold the wafer and keep the hermeticity perfect when the lamination roller is passing
» The edge contact chucks are availalble
for wafers from 5 to 12"
and fit particularly well with bumped wafers, MEMS, sensors...having a delicate active side which does not allow contacting
» Efficient also for thin wafers
Models
CSC6
: Chuck sans contact 6"
CSC8
: Chuck sans contact 8"
CSC12
: Chuck sans contact 12"
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