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Category :
C - WAFER/FRAME FILM LAMINATION
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 | UManual wafer/frame film applicator with uniform adhesion & film tension no bubbles, (wafer stress released)
» Temperature controlled platen, buil-in circular cutter for cutting film on film frame & buil-in end cutter for film separation
» Operates with backed or non backed films (option)
» Accepts all film frames
» Vacuum securing wafer stage offered in 2 versions (standard or thin-wafer-chuck..)
»The 12" model can accommodate 8" too with adaptation parts
See also the UH114 "Big brother" UH115 |
| Models |  UH114 : Wafer/frame film mounter up to 6" |
| UH114-8 : Wafer/frame film mounter up to 8" |
| UH114-12 : Wafer/frame film mounter 8-12" |
| |  | Semi-automatic Wafer/frame film applicator with motor-assisted film unwinding & Motor driven one-pass uniform lamination, New "Crease line-free" lamination area, unifor film tension (wafer stress released), temperature controlled platen, buil-in circular cutter (blade-type) for cutting film on film frame, optional wheel-type, operates with backed or non backed films,
accepts all film frame, vacuum securing wafer stage offered in different versions (standard, edge contact with only peripheral contact for bumped wafers or fragile...), buil-in end cutter for film separation, allows mounting of thin wafers (min thickness depending on size). |
| Models | UH115-12 : Semi-automatic Wafer/Frame film mounter 8-12" |
| UH115 : Semi-automatic Wafer/Frame film mounter up to 6" |
| UH115-8 : Semi-automatic Wafer/Frame film mounter up to 8" |
| |  | The replaceable circular cutting knife blade is now replaced by the "Wheel-type" cutter which allows a much longer lifetime
» The Wheel-type is field retrofittable
» Please consult MW with your machine serial number to obtain a quote |
| |  | The alternative to the standard circular cutting knives (blade type) where the frequent replacement when worn out can be a problem in production
» The Wheel type cutter is using a non-wearing roller wheel with adjustable depth upon the film thickness
» The lifetime is very high & No maintenance is required
» This new wheel cutting type is mounted on new equipment and is now retrofitted to the olders, please consult MW for details. |
| |  | These vacuum chucks are used for 2 to 12" wafers
» The vacuum is distributed from the center through a small cross and they are particularly recommended for "normal" thicknesses wafers
» For thin wafers or bumped wafers not allowing contact on the active side, specific thin wafers chucks or non-contact "SofTouch" may be more adapted. |
| Models | CVS4602001 : Standard vacuum multi-chuck 3-6" |
|  Search limited to 3 Models / Product |
 | Vacuum chuck with peripheral contact only (<3mm) on the wafer, allows mounting and holding wafers with bumps or particularly fragile with no contact on the active side
» A new silicone rubber seal insures that the vacuum will hold the wafer and keep the hermeticity perfect when the lamination roller is passing
» The edge contact chucks are availalble for wafers from 5 to 12" and fit particularly well with bumped wafers, MEMS, sensors...having a delicate active side which does not allow contacting
» Efficient also for thin wafers |
| Models | CSC6 : Chuck sans contact 6" |
| CSC8 : Chuck sans contact 8" |
| CSC12 : Chuck sans contact 12" |
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