Wafer backlapping film applicators

+ d'infos..

Smooth and repeatable lamination of the adhesive film without bubbles and stress for the wafer with UH108 & UH108-8, simple and low cost wafer backlapping film applicators » The circle cut follows the edge of the wafer including the flat » Several options such as protective film take-up roller, elimination of static electricity » A variety of chuck upon sizes and thicknesses of the substrates will cover a great majority of applications » It is a necessary complement to the big automatic production systems when punctual operation is needed on a small volume.

Models

UH108-12 : Wafer backlapping up to 12"

UH108 : Wafer backlapping up to 6"

UH108-8 : Wafer backlapping up to 8"

Wafer backlapping film remover

+ d'infos..

This equipment will automatically remove the protective adhesive tape after backgrinding operations » The wafer loading is manual and the sequence of film removal is done automatically » The vacuum chuck holding the wafer can be standard for most wafers or special for thin wafers » Thicknesses of 200µm can be achieved.

Models

UH110 : Wafer backlapping film remover up to 6"

UH110-8 : Wafer backlapping film remover up to 8"