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Category :
5 - DICING OF SILICON AND OTHER SUBSTRATES
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 | Diamond dicing wheel with metal bond for dicing of thin semiconductors materials
» Applications : Silicon GaAs, InP...and all materials used in semiconductors research or production environment
» Ready to mount on dicing machine spindle
» Available in various thicknesses/exposures
» Specific diamond grit sizes adapted to most standard applications (best compromise between feed rate and chipping)
» Optionally other models are available so as to cover most of the microelectronic dicing applications. |
| Models |  LM30815 : Metal bonded dicing blade thickness 20µm |
| LM50815 : Metal bonded dicing blade thickness 20µm |
| LM50820 : Metal bonded dicing blade thickness 20µm |
|  Search limited to 3 Models / Product |
 | High quality dicing blade flange used for dicing saw having an arbor of 19,05mm
» It comes in 2 parts assembled by a O'ring and accept resin or metal blades up to 380µm thickness (special model provide "extended hub" for higher thickness)
» Material stainless steel or titanium (lighter and stronger)
» Intermediate exposure sizes are available in 125µm increments
» A dismounting tool model #218253 is required the separate the male and female part
» A variety of spacers is available for alternate use of resin or metal blade to eliminate the need to readjust coolant nozzles... |
| Models | 2187BA10S /T : Flange exp 0,25mm for dicing blade of 55,55x40mm |
| 2187BA15S /T : Flange exp 0,38mm for dicing blade of 55,55x40mm |
| 2187BA20S /T : Flange exp 0,51mm for dicing blade of 55,55x40mm |
| Search limited to 3 Models / Product |
 | High quality dicing blade flange used for dicing saw having an arbor of 19,05mm
» It comes in 2 parts assembled by a O'ring and accept resin or metal blades up to 380µm thickness (special model provide "extended hub" for higher thickness)
» Material stainless steel or titanium (lighter and stronger)
» Intermediate exposure sizes are available in 125µm increments
» A dismounting tool model #218253 is required the separate the male and female part
» A variety of spacers is available for alternate use of resin or metal blade to eliminate the need to readjust coolant nozzles... |
| Models | 225BA10S /T : Flange exp 0,25mm for dicing blade of 57,15x38,10mm |
| 225BA15S /T : Flange exp 0,38mm for dicing blade of 57,15x38,10mm |
| 225BA20S /T : Flange exp 0,51mm for dicing blade of 57,15x38,10mm |
| Search limited to 3 Models / Product |
 | High quality dicing blade flange used for dicing saw having an arbor of 19,05mm
» It comes in 2 parts assembled by a O'ring and accept resin or metal blades up to 380µm thickness (special model provide "extended hub" for higher thickness)
» Material stainless steel or titanium (lighter and stronger)
» Intermediate exposure sizes are available in 125µm increments
» A dismounting tool model #218253 is required the separate the male and female part
» A variety of spacers is available for alternate use of resin or metal blade to eliminate the need to readjust coolant nozzles... |
| Models | 225MBA10S /T : Flange exp 0,25mm for dicing blade 57,15x40mm |
| 225MBA15S /T : Flange exp 0,38mm for dicing blade 57,15x40mm |
| 225MBA20S /T : Flange exp 0,51mm for dicing blade 57,15x40mm |
| Search limited to 3 Models / Product |
 | High quality dicing blade flange used for dicing saw having an arbor of 19,05mm
» It comes in 2 parts assembled by a O'ring and accept resin or metal blades up to 380µm thickness (special model provide "extended hub" for higher thickness)
» Material stainless steel or titanium (lighter and stronger)
» Intermediate exposure sizes are available in 125µm increments
» A dismounting tool model #218253 is required the separate the male and female part
» A variety of spacers is available for alternate use of resin or metal blade to eliminate the need to readjust coolant nozzles... |
| Models | 3MBA10S /T : Flasque exp 0,25mm pour lame de découpe 76,20x40mm |
| 3MBA15S /T : Flasque exp 0,38mm pour lame de découpe 76,20x40mm |
| 3MBA20S /T : Flasque exp 0,51mm pour lame de découpe 76,20x40mm |
| Search limited to 3 Models / Product |
 | High quality dicing blade flange used for dicing saw having an arbor of 31.75mm
» It comes in 2 parts assembled with a nut and accept resin blades of 109.22x76.20mm up to 508µm thickness (special model provide "extended hub" for higher thickness)
» Recommended torque 30in.lbs
» Material stainless steel (male) on black anodized aluminium (female) or titanium (lighter and stronger) on black anodized aluminium
» Intermediate exposure sizes are available in 125µm increments |
| Models | 43BA10S /T : Flange exp 0,25mm for dicing blade 109,22x76,20mm |
| 43BA15S /T : Flange exp 0,38mm for dicing blade 109,22x76,20mm |
| 43BA20S /T : Flange exp 0,51mm for dicing blade 109,22x76,20mm |
| Search limited to 3 Models / Product |
 | High quality dicing blade flange used for dicing saw having an arbor of 31.75mm
» It comes in 2 parts assembled with a nut and accept resin blades of 114x70mm up to 508µm thickness (special model provide "extended hub" for higher thickness)
» Recommended torque 30in.lbs
» Material stainless steel (male) on black anodized aluminium (female) or titanium (lighter and stronger) on black anodized aluminium
» Intermediate exposure sizes are available in 125µm increments |
| Models | 45BA10S /T : Flange exp 0,25mm for dicing blade 114,30x69,85mm |
| 45BA15S /T : Flange exp 0,38mm for dicing blade 114,30x69,85mm |
| 45BA20S /T : Flange exp 0,51mm for dicing blade 114,30x69,85mm |
| Search limited to 3 Models / Product |
 | High quality dicing blade flange used for dicing saw having an arbor of 31.75mm
» It comes in 2 parts assembled with a nut and accept resin blades of 117x90mm up to 508µm thickness (special model provide "extended hub" for higher thickness)
» Recommended torque 30in.lbs
» Material stainless steel (male) on black anodized aluminium (female) or titanium (lighter and stronger) on black anodized aluminium
» Intermediate exposure sizes are available in 125µm increments |
| Models | 46BA10S /T : Flange exp 0,25mm for dicing blade 116,84x88,90mm |
| 46BA15S /T : Flange exp 0,38mm for dicing blade 116,84x88,90mm |
| 46BAS /T : Flange exp 0,51mm for dicing blade 116,84x88,90mm |
| Search limited to 3 Models / Product |
 | Thermo-sensitive Wax specific for dicing (will not load the blades) for mounting of the substrates to another carrier such as glass for applications where the substrate is very fragile and the process of dicing difficult to set up
» The Wax can be removed after the work with a solution of alcool or Borax
» The advantage of using rigid mounting is the perfect holding of the substrate contrary to the use of plastic adhesive tapes and thus the ease of dicing into hard & delicate substrates with keeping an utmost quality |
| Models | 40D : Wax for rigid mounting of substrates |
| |  | Used for metal and resin bond dicing blades : Our dresser plates are made up of the highest quality abrasives for removing excess nickel from the diamond cutting edges on new metal-bonded diamond blades
» Additionally, they aid in exposing new sharp cutting edges when the blade has dulled from continuous cutting or from operating under loading conditions
» Dressing of a new dicing blade is recommended in order to reduce the chance of breakage during the initial break-in period. Additionally, just a few passes through the dresser plate's high quality abrasive core will aid in opening up the blade's cutting surfaces when resultant forces on the cutting edge are not enough to impart the blade's self-sharpening characteristics.
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| Models | GC600-30 : Dressing plates 75x75x1mm |
| |  | Improper handling or unclean assembly will hinder the performance of even the newest of flanges
» Lapping kits are available for the replenishing of male and female surfaces of flanges used on all dicing equipment
» Simply changing a blade can leave diamond particles on the bearing surface of the flange, which will prevent proper seating between the mating surfaces
» The diamond imbeds itself in the bearing surface and can only be removed by proper and effective lapping procedures
» An Effective Maintenance Solution is provided with a complete flange lapping system specifically for the maintenance of flanges used in mounting diamond dicing blades
» This kit allows for minor repairs to the bearing surfaces of the flange
» Available for Most Flange Sizes, the flange lapping kit is complete with lapping plate, abrasive compound, instructions, fitted wooden case
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| Models | BAFLK : Polishing kit for flanges with blades of 50 to 57 mm diameter |
| 3MBAFLK : Polishing kit for flanges with blades of 76 mm diameter |
| DBAFLK : Polishing kit for "Disco Style" flanges with blades of 50-57 mm diameter |
| Search limited to 3 Models / Product |
 | Specific Ultra-violet emission lamps used on UV curing equipment
» Filled with Mercury pressure and with special shapes offering a greater UV coverage and homogeneity
» Wavelengths 254 or 365nm and different output powers upon model
» the lifetime typically goes from 1000 to 2000 hrs depending on the type of lamps and useage |
| Search limited to 3 Models / Product |
 | The UH130 automatically expand the adhesive tape so as to present the dies in an evenly spaced parallel matrix to facilitate pick-and-place or die attach operations
» Able to adapt to all wafer/film frame up to 300mm, temperature-controlled heated stage
» 3-inch vertical stroke control with speed control & upper and lower clamp assembly for different size wafers
» Increases throughput and yield through gentle die separation
» optional : Automatic circular cutter, automatic insertion of outer ring
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| Models | UH130 : Die Matrix expander up to 8" |
| |  | Compact and lightweight, these UV lamps are particularly usefull for low power irradiation in laboratory or for UV process set up
» Emitting on a single wavelenght, either short waver or long wave
» Although handheld, they can be used with an optional stand
» Several models not listed here are available, please consult with application details |
| Models | G11 : Handheld UV lamp, 4W, 254nm |
| L21 : Handheld UV lamp, 4W, 365nm |
| G54 : Handheld UV lamp, 6W, 254nm |
| Search limited to 3 Models / Product |
 | Compact and lightweight with selection by switch of one out of 2 available wavelenghts, either short wave or long wave
» these UV lamps are particularly usefull for low power irradiation in laboratory or forUV process set up
» Although handheld, they can be used with an optional stand
» Other models not listed here available, please consult |
| Models | GI25 : Handheld UV lamp, 4W, 254 & 365 nm |
| GL58 : Handheld UV lamp, 6W, 254 & 365 nm |
| |  | Used to firmly maintain the adhesive film during dicing processes or typically after a film expansion
» These plastic griprings are made in strong polycarbonate
» A typical use is expanding from metal wafer-frame to plastic ring with an equipment of the UH130 family largely separating the dies for a safe picking
» The black rings are conductive and antistatic
» Available for 12" wafers |
| Models | AP4 : Plastic gripring for 4" wafer |
| AP4B : Antistatic gripring for 4" wafer |
| AP5 : Plastic Gripring for 5" wafer |
| Search limited to 3 Models / Product |
 | Wafer film frames for 6" (and smaller), 8", 12" wafers
» Stainless steel material
» Supplied in several sizes depending upon dicing equipment used & Wafer size
» Consult MW for more details & Pricing...
» Plastic frames available too, see the different models |
| Models | FF020 : Wafer film frame for 4" wafers |
| FF070 : Wafer film frame for 6" wafers |
| FF070P : Plastic wafer film frame for 6" wafers |
| Search limited to 3 Models / Product |
 | Benchtop low-profile system The UH104 offers an exceptional flexibility and repeatability in the curing of UV films for dicing or backgrinding
» Manual loading
» Automatic UV process
» Replaceable ozone-free UV lamp, 364nm
» Ideal for Low volume / R&D applications
Available in 2 versions for wafers up to 8" or 12". |
| Models | UH104 : Model UH104 up to 8" |
| |  | Model for wafers up to 8" (naked or frame-mounted), up to 99 fully programmable cleaning-rincing-drying steps, microprocessor control for precision, flexibility, uniformity
» Non-volatile memory for program storage, interchangeable chuck capability, hot air over the wafer surface for efficient drying
» Standard wafer/wafer carrier chuck with vacuum hold down
» Cleaning by brushing is the only efficient method to remove debris between dies after dicing. |
| |  | Model for wafers up to 12" (naked or frame-mounted), up to 99 fully programmable cleaning-rincing-drying steps, microprocessor control for precision, flexibility, uniformity, with non-volatile memory for program storage
» Brush speed, stage height & speed programmable
» Interchangeable chuck capability, hot air over the wafer surface for efficient drying, standard wafer/wafer carrier chuck with vacuum hold down
» Precise height adjustment of the brush at the front panel for an optimal cleanning even in non-contact |
| |  | Recently released, the NDS200 is a new dicing saw with advanced features specifically adapted for Semiconductor materials cutting (Si, GaAs, LiNBO3, LitAO3, and hard and brittle materials such as glass, ceramics, quartz...
» 0.1mm/s to 400mm/s of feedrate allows prototying and production dicing
» The saw accepts hubless or hubtype blades with metal or resin bond up to 3" diameter
» Pc control programming for easy set up
» Joystick control for manual control of specific cutting (irregular pitch or depth...)
» Accepts all sample sizes up to 8"
» CE mark for use in Europe |
| |  | Usefull when the dicing equipment is called to receive either metal bond type blades or annular resin type blades that are assembled within flange
» The spacer compensates the thickness difference of both cases and allows an optimal adjustment of the dicing equipment for each dicing application |
| |  | Resin blades in thicknesses from 38µm to 1mm and more
» Assembled within a flange, replaceable after use
» These blades present the advantage of having the same diameter than the metal blades, allowing the use of both blades on the same equipment. the grit size ranges from 0,5 to 151µm allowing most dicing applications of thin ceramics, glass, ferrites...
» The resin blades can also be used on silicon and other semiconductor materials when standard metal blades are not available or for specific applications
» Exist in different version of bond hardness depending upon priority low chipping or lifetime
» Adapted flange & Polishing kits & Dressing blocks available, see other accessories. |
| Models | 2187 1.5A G M : Diamond dicing blade, 55,55x40x0,038mm, Resin bond & Grit 0,5 to 9 µm (specify) |
| 2187 2A G M : Diamond dicing blade, 55,55x40x0,051mm, Resin bond & Grit size 0,5 to 15 µm (specify) |
| 2187 3A G M : Diamond dicing blade, 55,55x40x0,076mm, resin bond & Grit size 0,5 to 30 µm (specify) |
| Search limited to 3 Models / Product |
 | UManual wafer/frame film applicator with uniform adhesion & film tension no bubbles, (wafer stress released)
» Temperature controlled platen, buil-in circular cutter for cutting film on film frame & buil-in end cutter for film separation
» Operates with backed or non backed films (option)
» Accepts all film frames
» Vacuum securing wafer stage offered in 2 versions (standard or thin-wafer-chuck..)
»The 12" model can accommodate 8" too with adaptation parts
See also the UH114 "Big brother" UH115 |
| Models | UH114 : Wafer/frame film mounter up to 6" |
| UH114-8 : Wafer/frame film mounter up to 8" |
| UH114-12 : Wafer/frame film mounter 8-12" |
| |  | Resin dicing blades similar to previous serie 2187 but with outside diameter of 2.25" (57.15mm)
» Thicknesses from 38µm to 1mm and more
» The specific Inside diameter requests an adapted flange. |
| Models | 225 1.5A G M : Diamond dicing blade, 57,15x38,1x0,038mm, resin bond & grit 0,5 to 9 µm (specify) |
| 225 2A G M : Diamond dicing blade, 57,15x38,1x0,051mm, resin bond & grit 0,5 to 15 µm (specify) |
| 225 3A G M : Diamond dicing blade, 57,15x38,1x0,076mm, resin bond & grit 0,5 to 30 µm (specify) |
| Search limited to 3 Models / Product |
 | Semi-automatic Wafer/frame film applicator with motor-assisted film unwinding & Motor driven one-pass uniform lamination, New "Crease line-free" lamination area, unifor film tension (wafer stress released), temperature controlled platen, buil-in circular cutter (blade-type) for cutting film on film frame, optional wheel-type, operates with backed or non backed films,
accepts all film frame, vacuum securing wafer stage offered in different versions (standard, edge contact with only peripheral contact for bumped wafers or fragile...), buil-in end cutter for film separation, allows mounting of thin wafers (min thickness depending on size). |
| Models | UH115 : Semi-automatic Wafer/Frame film mounter up to 6" |
| UH115-8 : Semi-automatic Wafer/Frame film mounter up to 8" |
| UH115-12 : Semi-automatic Wafer/Frame film mounter 8-12" |
| |  | Resin dicing blades similar to previous serie 225 but with Inside diameter of 40 mm (same as 2187 serie)
» Thicknesses from 38µm to 1mm and more
» The 40 mm Inside diameter allows using the same flange as used with the 2187 serie with a little more exposure. |
| Models | 225M 1.5A G M : Diamond dicing blade, 57,15x40x0,038mm, resin bond & grit 0,5 to 9 µm (specify) |
| 225M 2A G M : Diamond dicing blade, 57,15x40x0,038mm, resine bond & grit 0,5 to 15 µm (specify) |
| 225M 3A G M : Diamond dicing blade, 57,15x40x0,0 76mm, resin bond & grit 0,5 to 30 µm (specify) |
| Search limited to 3 Models / Product |
 | Resin dicing blades similar to serie 225 but with outside diameter of 3" (76 mm)
» Thicknesses from 100 µm to 1mm and more
» The specific Inside diameter requests an adapted flange
» This blade requests a dicing equipment accepting 3" serie blades |
| Models | 3-102A-GM : Diamond dicing blade, 76,2x51x0,102mm, resin bond & grit 0,5 to 40 µm (specify) |
| 3-127A-GM : Diamond dicing blade, 76,2x51x0,127mm, resin bond & grit 0,5 to 46 µm (specify) |
| 3-152A-GM : Diamond dicing blade, 76,2x51x0,152mm, resin bond & grit 0,5 to 54 µm (specify) |
| Search limited to 3 Models / Product |
 | Medium adhesive strenght PVC based film with acrylic adhesive for dicing of microelectronic materials
» Silicone release agent free (no contamination)
» Total thickness 80µm
» For wafer and other substrate of any type
++ See all models of standard and UV tapes |
| Models | F0760 : Standard adhesive tape 100 m roll, 152 mm width |
| F0765 : Standard adhesive tape 100 m roll, 165 mm width |
| F0770 : Standard adhesive tape 100 m roll, 178 mm width |
| Search limited to 3 Models / Product |
 | Resin dicing blades similar to serie 3 but with Inside diameter of 40 mm
» Thicknesses from 100 µm to 1mm and more
» The specific Inside diameter requests an adapted flange
» This blade requests a dicing equipment accepting 3" serie blades |
| Models | 3M-102A-GM : Diamond dicing blade, 76,2x40x0,102mm, resin bond & grit 0,5 to 40 µm (specify) |
| 3M-127A-GM : Diamond dicing blade, 76,2x40x0,127mm, resin bond & grit 0,5 to 46 µm (specify) |
| 3M-152A-GM : Diamond dicing blade, 76,2x40x0,152mm, resin bond & grit 0,5 to 54 µm (specify) |
| Search limited to 3 Models / Product |
 | The replaceable circular cutting knife blade is now replaced by the "Wheel-type" cutter which allows a much longer lifetime
» The Wheel-type is field retrofittable
» Please consult MW with your machine serial number to obtain a quote |
| |  | The alternative to the standard circular cutting knives (blade type) where the frequent replacement when worn out can be a problem in production
» The Wheel type cutter is using a non-wearing roller wheel with adjustable depth upon the film thickness
» The lifetime is very high & No maintenance is required
» This new wheel cutting type is mounted on new equipment and is now retrofitted to the olders, please consult MW for details. |
| |  | 4" resin blades in thicknesses from 100µm to 1mm and more
» Assembled within a flange, replaceable after use
» The grit size ranges from 0,5 to 151µm allowing most dicing applications of thin ceramics, glass, ferrites...
» Exist in different version of bond hardness depending upon priority low chipping or lifetime
» Adapted flanges & Polishing kits & Dressing blocks available, see other accessories
» The blades mount on specific 4" blade serie dicing:machining equipment |
| Models | 4 4A G M : Diamond dicing blade, 101,6x69x0,102mm, resin bond & grit 0,5 to 40 µm (specify) |
| 4 5A G M : Diamond dicing blade, 101,6x69,85x0,127mm, resin bond & grit 0,5 to 46 µm (specify) |
| 4 6A G M : Diamond dicing blade, 101,6x69,85x0,152mm, resin bond & grit 0,5 to 54 µm (specify) |
| Search limited to 3 Models / Product |
 | 4.3" resin blades in thicknesses from 100µm to 1mm and more
» Assembled within a flange, replaceable after use
» The grit size ranges from 0,5 to 151µm allowing most dicing applications of thin ceramics, glass, ferrites...
» Exist in different version of bond hardness depending upon priority low chipping or lifetime
» Adapted flanges & Polishing kits & Dressing blocks available, see other accessories
» The blades mount on specific 4" blade serie dicing:machining equipment |
| Models | 43-102A-GM : Diamond dicing blade, 110x76x0,1mm, resin bond & grit 0,5 to 40 µm (specify) |
| 43-127A-GM : Diamond dicing blade, 110x76x0,125mm, resin bond & grit 0,5 to 46 µm (specify) |
| 43-152A-GM : Diamond dicing blade, 110x76x0,152mm, resin bond & grit 0,5 to 54 µm (specify) |
| Search limited to 3 Models / Product |
 | 4.5" resin blades in thicknesses from 100µm to 1mm and more
» Assembled within a flange, replaceable after use
» The grit size ranges from 0,5 to 151µm allowing most dicing applications of thin ceramics, glass, ferrites...
» Exist in different version of bond hardness depending upon priority low chipping or lifetime
» Adapted flanges & Polishing kits & Dressing blocks available, see other accessories
» The blades mount on specific 4" blade serie dicing:machining equipment |
| Models | 45-102A-GM : Diamond dicing blade, 114,3x69,85x0,102mm, resin bond & grit 0,5 to 40 µm (specify) |
| 45-127A-GM : Diamond dicing blade, 114,3x69,85x0,127mm, resin bond & grit 0,5 to 46 µm (specify) |
| 45-152A-GM : Diamond dicing blade, 114,3x69,85x0,152mm, resin bond & grit 0,5 to 54 µm (specify) |
| Search limited to 3 Models / Product |
 | 4.6" resin blades in thicknesses from 75 µm to 1mm and more
» Assembled within a flange, replaceable after use
» The grit size ranges from 0,5 to 151µm allowing most dicing applications of thin ceramics, glass, ferrites...
» Exist in different version of bond hardness depending upon priority low chipping or lifetime
» Adapted flanges & Polishing kits & Dressing blocks available, see other accessories
» The blades mount on specific 4" blade serie dicing:machining equipment |
| Models | 46-76A-GM : Diamond dicing blade, 116,84x88,9x0,076mm, resin bond & grit 0,5 to 30 µm (specify) |
| 46-102A-GM : Diamond dicing blade, 116,84x88,9x0,102mm, resin bond & grit 0,5 to 40 µm (specify) |
| 46-127A-GM : Diamond dicing blade, 116,84x88,9x0,127mm, resin bond & grit 0,5 to 46 µm (specify) |
| Search limited to 3 Models / Product |
 | Medium-high adhesive strenght PVC based film with acrylic adhesive for dicing of microelectronic materials
» Silicone release agent free (no contamination)
» Total thickness 80µm
» For wafer and other substrate of any type
++ See all models of standard and UV tapes |
| Models | F0860 : Standard adhesive tape in 100 m roll, 152 mm width |
| F0865 : Standard adhesive tape in 100 m roll, 165 mm width |
| F0870 : Standard adhesive tape in 100 m roll, 178 mm width |
| Search limited to 3 Models / Product |
 | These vacuum chucks are used for 2 to 12" wafers
» The vacuum is distributed from the center through a small cross and they are particularly recommended for "normal" thicknesses wafers
» For thin wafers or bumped wafers not allowing contact on the active side, specific thin wafers chucks or non-contact "SofTouch" may be more adapted. |
| Models | CVS4602001 : Standard vacuum multi-chuck 3-6" |
| Search limited to 3 Models / Product |
 | Vacuum chuck with peripheral contact only (<3mm) on the wafer, allows mounting and holding wafers with bumps or particularly fragile with no contact on the active side
» A new silicone rubber seal insures that the vacuum will hold the wafer and keep the hermeticity perfect when the lamination roller is passing
» The edge contact chucks are availalble for wafers from 5 to 12" and fit particularly well with bumped wafers, MEMS, sensors...having a delicate active side which does not allow contacting
» Efficient also for thin wafers |
| Models | CSC6 : Chuck sans contact 6" |
| CSC8 : Chuck sans contact 8" |
| CSC12 : Chuck sans contact 12" |
| |  | Low adhesive strenght PVC based film with acrylic adhesive for dicing of microelectronic materials
» Silicone release agent free (no contamination)
» Total thickness 80µm
» For wafer and other substrate of any type
++ See all models of standard and UV tapes |
| Models | F0960 : Standard Adhesive tape in 100 m roll, 152 mm width |
| F0965 : Standard Adhesive tape in 100 m roll, 165 mm width |
| F0970 : Standard Adhesive tape in 100 m roll, 178 mm width |
| Search limited to 3 Models / Product |
 | Manual UV curing system up to 300mm wafer (on frame) capability, available in 2 versions upon size of wafers & Frames
Self-contained bench-top model
» Easily programmable (curing time), micro-processor-based controller, nitrogen purge for efficient curing, lamp intensity measurement port
»Serpentine-style grid UV lamp for even consistent UV-exposure and high degree of homogeneity, allow curing of most available adhesive UV tape mounted on frames or rings
» ideal for small to mid-volume production and R&D applications |
| Models | UH102 : Manual UV curing system up to 8" |
| UH102-12 : Manual UV curing system up to 12" |
| |  | PVC based film with UV sensitive adhesive, total thickness 95µm
» The PVC allows a good and homogeneous expansion after dicing in order to separate the dies for a safe picking
» The UV features alllow a high adhesion while dicing and a low adhesion after UV curing for picking
» The F20 is a popular serie used by leaders of microelectronic fields
» Supplied in 100m roll, any lenght
++ See all models of standard and UV tapes |
| Models | F2060 : UV adhesive tape 100 m roll 152 mm width |
| F2065 : UV adhesive tape 100 m roll 165 mm width |
| F2070 : UV adhesive tape 100 m roll 178 mm width |
| Search limited to 3 Models / Product |
 | UV antistatic adhesive tape thickness 100µm polyolefin base
» High adhesive power for dicing - Low adhesion after UV cure
» The smoothness of the polyolefin does not allow the same homogeneous expansion as the PVC base
» Supplied in 100m roll, any lenght
» Also used in backgrinding applications, SEE
++ See all models of standard and UV tapes |
| Models | F4260 : UV antistatic Adhesive tape 100 m roll, 152 mm width |
| F4265 : UV antistatic Adhesive tape 100 m roll, 165 mm width |
| F4270 : UV antistatic Adhesive tape 100 m roll, 178 mm width |
| Search limited to 3 Models / Product |
 | 8"and 12" fully automatic single cassette operation (loading frames & Unloading same cassette), with optional single frame for rapid testing, programmable and storage of up to 10 programs with password
» Auto-detection of vacant slots in frame magazine and interferences (jams)
» High intensity UV lamp with temperature indicator and shutt off if necessary
» Mechanical door interlock during UV cycles
» Cycle times of 9 to 12s including loading, UV exposure and unloading, a 25 frames cassette is completed in 4 min (6 for 12")
» Accepts single-aluminium extruded cassette complete or partial. |
| Models | UH204 : UV automatic system up to 8" |
| UH204-12 : UV automatic system up to 12" |
| |  | UV antistatic adhesive tape thickness 175µm polyolefin base
» High adhesive power for dicing - Low adhesion after UV cure
» The smoothness of the polyolefin does not allow the same homogeneous expansion as the PVC base
» Supplied in 100m roll, any lenght
» Also used in backgrinding applications
++ See all models of standard and UV tapes |
| Models | F4360 : UV antistatic adhesive tape 100 m roll, 152 mm width |
| F4365 : UV antistatic adhesive tape 100 m roll, 165 mm width |
| F4370 : UV antistatic adhesive tape 100 m roll, 178 mm width |
| Search limited to 3 Models / Product |
 | UV antistatic adhesive tape thickness 268µm polyolefin base
» High adhesive power for dicing - Low adhesion after UV cure
» The smoothness of the polyolefin does not allow the same homogeneous expansion as the PVC base
» Supplied in 100m roll, any lenght
» Also used in backgrinding applications
++ See all models of standard and UV tapes |
| Models | F4460 : UV antistatic adhesive tape 100 m roll, 152 mm width |
| F4465 : UV antistatic adhesive tape 100 m roll, 165 mm width |
| F4470 : UV antistatic adhesive tape 100 m roll, 178 mm width |
| Search limited to 3 Models / Product |
 | PET based very high tack film with UV sensitive adhesive, total thickness 135µm
» Ideal for thin wafers & Minimum chipping & Narrow cut streets...
» The very high adhesion assures a perfect and stable mounting of the die & substrate while cutting close to a hard mounting (wax mount)
» The PET base is not expandable
» Supplied in 50m roll, any lenght
++ See all models of standard and UV tapes |
| |  | Very low adhesive strenght PVC based film with acrylic adhesive for dicing of microelectronic materials
» Silicone release agent free (no contamination)
» Total thickness 80µm
» For wafer and other substrate of any type
++ See all models of standard and UV tapes |
| Models | F1160 : Standard adhesive tape in 100 m roll, 152 mm width |
| F1165 : Standard adhesive tape in 100 m roll, 165 mm width |
| F1170 : Standard adhesive tape in 100 m roll, 178 mm width |
| Search limited to 3 Models / Product |
 | Very high adhesive strenght PVC based film 135µm thick with acrylic adhesive for dicing of microelectronic materials
» Silicone release agent free (no contamination)
» Total thickness 80µm
» For wafer and other substrate of any type
++ See all models of standard and UV tapes |
| Models | F0360 : Standard adhesive tape in 100 m roll, 152 mm width |
| F0365 : Standard adhesive tape in 100 m roll, 165 mm width |
| F0370 : Standard adhesive tape in 100 m roll, 178 mm width |
| Search limited to 3 Models / Product |
 | High adhesive strenght PVC based film 135µm thick with acrylic adhesive for dicing of microelectronic materials
» Silicone release agent free (no contamination)
» Total thickness 80µm
» For wafer and other substrate of any type
++ See all models of standard and UV tapes |
| Models | F0460 : Standard adhesive tape in 100m roll, 152 mm width |
| F0465 : Standard adhesive tape in 100 m roll, 165 mm width |
| F0470 : Standard adhesive tape in 100 m roll, 178 mm width |
| Search limited to 3 Models / Product |
 | Medium-high adhesive strenght PVC based film 135µm thick with acrylic adhesive for dicing of microelectronic materials
» Silicone release agent free (no contamination)
» Total thickness 80µm
» For wafer and other substrate of any type
++ See all models of standard and UV tapes |
| Models | F0560 : Standard adhesive tape in 100 m roll, 152 mm width |
| F0565 : Standard adhesive tape in 100 m roll, 165 mm width |
| F0570 : Standard adhesive tape in 100 m roll, 178 mm width |
| Search limited to 3 Models / Product |
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