Wafer backlapping film applicators

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Smooth and repeatable lamination of the adhesive film without bubbles and stress for the wafer with UH108 & UH108-8, simple and low cost wafer backlapping film applicators » The circle cut follows the edge of the wafer including the flat » Several options such as protective film take-up roller, elimination of static electricity » A variety of chuck upon sizes and thicknesses of the substrates will cover a great majority of applications » It is a necessary complement to the big automatic production systems when punctual operation is needed on a small volume.

Models

UH108 : Wafer backlapping up to 6"

UH108-8 : Wafer backlapping up to 8"

UH108-12 : Wafer backlapping up to 12"

Wafer backlapping film remover

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This equipment will automatically remove the protective adhesive tape after backgrinding operations » The wafer loading is manual and the sequence of film removal is done automatically » The vacuum chuck holding the wafer can be standard for most wafers or special for thin wafers » Thicknesses of 200µm can be achieved.

Models

UH110 : Wafer backlapping film remover up to 6"

UH110-8 : Wafer backlapping film remover up to 8"

Standard Vacuum chuck

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Vacuum chucks for wafer backgrinding film remover are available for wafers from 3 to 6 " » The vacuum is distributed mostly at the center and they are suitable for "normal thicknesses" wafers » For thinner wafers, the specific thin wafer vacuum chucks (multiple drilled vacuum holes) may be more adapted.

Models

CV10128003 : Standard Vacuum Chuck for wafer up to 3"

CV10128004 : Standard Vacuum Chuck for wafer up to 4"

CV10128005 : Standard Vacuum Chuck for wafer up to 5"

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Thin wafer Vacuum chuck

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Specific chuck for wafer backgrinding film remover and film applicator The thin wafer chuck is drilled with multiple holes for vacuum, thus spreading the vacuum around the surface and minimizing the stress on the wafer » Wafers with thickness less than 200µm can be processed without risk » The wafer size available ranges from 3 to 6"

Models

TWC0602063 : Thin wafer Vacuum chuck for wafer up to 3"

TWC0602064 : Thin wafer Vacuum chuck for wafer up to 4"

TWC0602066 : Thin wafer Vacuum chuck for wafer up to 6"

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Take up roller assembly for protective film

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This optional assembly is available on both the protective film laminators for backgrinding and the wafer-frame film laminator for dicing purpose. It allows winding the protective backing film onto a secondary take-up core simultaneously while unwinding the film for lamination on the wafer Most backgrinding tapes and UV tapes come with a backing layer to protect the adhesive and maintain the properties of the film.

Models

9108014002 : Enroulement pellicule de protection standard

9108014003 : Enroulement pellicule de protection pour bobine de 7"

Options : Static eliminator

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This optional assembly is available on both the protective film laminators for backgrinding and the wafer-frame film laminator for dicing purpose. It allows a downloading of static electricity developped while pulling out the film and thus protecting the wafer against accidental overshoots » Supplied with Simco transformer

Models

9114703002 : Static eliminator CE version

Film-cutting knife for wafer backgrinding laminators

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The replaceable circular cutting knife is an accessory of the wafer backgrinding films applicator, it is used for cutting the film precisely along the wafer edge » The wafer backgrinding film applicator allows a cut without contact with the edge » The knife is installed in a a few seconds when the cut quality gets poor and requires no adjustment » Sold by multiples of 3, pricing depending on quantity.

Models

CC08175000 : Circular cutting knife