Packaging of individual dies

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The packaging service is purposely for small quantities of prototypes (5 to 10 pieces max) » The typical applications is characterization on a packaged device instead of a single die in a final use environment » The pakaging includes the die bonding into the package cavity, the wire bonding with gold or alu wires » Optionally chip on board can be realized

Wafers & Thin substrates dicing

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Dicing of thin materials by specific diamond coated dicing wheels » Available for semiconductors wafers and materials up to 200mm diameter » III-V and exotic materials » Glass and ceramic dicing up to 120mm square and 2mm thick » Specific dicing work please consult

Individual die backthinning

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The operation consists of thinning the die from the backside using specific diamond coated grinding wheels » The typical applications are failures analysis or SEM inspection » The backthinning is possible down to 150µm