UH117 : Cleaning & Brushing equipment

+ d'infos..

Model for wafers up to 8" (naked or frame-mounted), up to 99 fully programmable cleaning-rincing-drying steps, microprocessor control for precision, flexibility, uniformity » Non-volatile memory for program storage, interchangeable chuck capability, hot air over the wafer surface for efficient drying » Standard wafer/wafer carrier chuck with vacuum hold down » Cleaning by brushing is the only efficient method to remove debris between dies after dicing.

UH118 : Cleaning & Brushing equipment

+ d'infos..

Model for wafers up to 12" (naked or frame-mounted), up to 99 fully programmable cleaning-rincing-drying steps, microprocessor control for precision, flexibility, uniformity, with non-volatile memory for program storage » Brush speed, stage height & speed programmable » Interchangeable chuck capability, hot air over the wafer surface for efficient drying, standard wafer/wafer carrier chuck with vacuum hold down » Precise height adjustment of the brush at the front panel for an optimal cleanning even in non-contact