Microworld - Product Datasheet, Wafer film frame used for dicing wafer-substrate

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Wafer film frame used for dicing wafer-substrate

5 - DICING OF SILICON AND OTHER SUBSTRATES > H - ACCESSORIES RELATED TO DICING > Plastic rings & Metal frames

Wafer film frames for 6" (and smaller), 8", 12" wafers
» Stainless steel material
» Supplied in several sizes depending upon dicing equipment used & Wafer size
» Consult MW for more details & Pricing...
» Plastic frames available too, see the different models

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General information
Base material	Stainless steel (or plastic)

Typical Applications
Suitable for equipment	Disco, K&S, TSK, µautomation...

Packaging & Price range
Packaging	minimum 10