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Semi-automatic Die Matrix expander
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5 - DICING OF SILICON AND OTHER SUBSTRATES > F - FILM EXPANSION AFTER DICING
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The UH130 automatically expand the adhesive tape so as to present the dies in an evenly spaced parallel matrix to facilitate pick-and-place or die attach operations
» Able to adapt to all wafer/film frame up to 300mm, temperature-controlled heated stage
» 3-inch vertical stroke control with speed control & upper and lower clamp assembly for different size wafers
» Increases throughput and yield through gentle die separation
» optional : Automatic circular cutter, automatic insertion of outer ring
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