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Semi-automatic Wafer/frame film applicator with motor-assisted film unwinding & Motor driven one-pass uniform lamination, New "Crease line-free" lamination area, unifor film tension (wafer stress released), temperature controlled platen, buil-in circular cutter (blade-type) for cutting film on film frame, optional wheel-type, operates with backed or non backed films,
accepts all film frame, vacuum securing wafer stage offered in different versions (standard, edge contact with only peripheral contact for bumped wafers or fragile...), buil-in end cutter for film separation, allows mounting of thin wafers (min thickness depending on size).
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